G/Q family of Intel® Express Chipsets: Thermal Design Guide
The document describes thermal design guidelines for using embedded Intel® G45, G41, Q45, Q35 and Q965 Express Chipsets in 1U and PICMG 1.3 form factors. The objective of designing the thermal solution is to maintain the case temperature of chipsets below the maximum allowable case temperature as specified in datasheet.
G/Q family of Intel® Express Chipsets Thermal Design Guide.
Explains virtualization fundamentals, business impact, industry factors, model comparisons, and more.
Explores Intel® Virtualization Technology, how it works, and common virtualization techniques.
Processor array reduces image resolution time for radar analytics. (v.1, Feb. 2011)
First Intel® Atom™ processor-based system-on-chip offers embedded system integration and flexibility.
Video analysis helps retailers optimize sales, operations, and security. (v.1, Feb. 2011)
Learn how intelligent digital advances and signage solutions enhance shopper experience.