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Intel® Core™2 Duo Mobile Processors: Thermal Design GuideThe power dissipation of electronic components has risen along with the increase in complexity of computer systems. To ensure quality, reliability, and performance goals are met over the product’s lifecycle, the heat generated by the device must be properly dissipated. Typical methods to improve heat dissipation include selective use of airflow ducting, and/or the use of heatsinks.The goals of this document are to:• Identify the thermal and mechanical specification for the device• Describe a reference thermal solution that meets the specificationsRead the full Intel® Core™2 Duo Mobile Processors Thermal Design Guide.
How better visuals, performance, and lower power and thermals improve platforms for embedded designs.
Discusses Intel® Atom™ LEAP* architecture and embedded systems instructions for energy efficiency.
Presents research on multi-core processor performance optimization under thermal constraints.
Intel® Xeon® processors provide power savings, scalability performance, integration, and more.
Overviews the Intel® Atom™ processor E6xx series’ features and compatibility.
Features and benefits include a variety of supported operating systems, software, and other tools.