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Intel® Core™2 Duo Mobile Processors: Thermal Design GuideThe power dissipation of electronic components has risen along with the increase in complexity of computer systems. To ensure quality, reliability, and performance goals are met over the product’s lifecycle, the heat generated by the device must be properly dissipated. Typical methods to improve heat dissipation include selective use of airflow ducting, and/or the use of heatsinks.The goals of this document are to:• Identify the thermal and mechanical specification for the device• Describe a reference thermal solution that meets the specificationsRead the full Intel® Core™2 Duo Mobile Processors Thermal Design Guide.
Provides an overview of heterogeneous architecture and power-performance.
Demonstrates 3D scanner technology powered by an Intel® processor.
Shadow puppet performance demos the use of Intel® Atom™ processors in puppet control; part 1.
Backstage view of a shadow puppet performance reveals the Intel® Atom™ processor-based robots; part 2.
Discusses some of the major problems with firmware development and validation.
Describes current research activities including embedded system design, verification, and testing.