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Intel® Xeon® Processor C5500/C3500 Series: Thermal GuideIntroduction This document provides guidelines for the design of thermal and mechanical solutions for processors in the Picket Post platform. The components described in this document include:•The processor thermal solution (heatsink) and associated retention hardware.•The LGA1366 socket and the Independent Loading Mechanism (ILM) and back plate.Read the full Intel® Xeon® Processor C5500/C3500 Series Thermal/ Mechanical Design Guide.
Intel® Xeon® processors provide power savings, scalability performance, integration, and more.
Presents research on multi-core processor performance optimization under thermal constraints.
Discusses Intel® Atom™ LEAP* architecture and embedded systems instructions for energy efficiency.
Processor array reduces image resolution time for radar analytics. (v.1, Feb. 2011)
Features and benefits include a variety of supported operating systems, software, and other tools.
First Intel® Atom™ processor-based system-on-chip offers embedded system integration and flexibility.