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Intel® Xeon® Processor C5500/C3500 Series: Thermal GuideIntroduction This document provides guidelines for the design of thermal and mechanical solutions for processors in the Picket Post platform. The components described in this document include:•The processor thermal solution (heatsink) and associated retention hardware.•The LGA1366 socket and the Independent Loading Mechanism (ILM) and back plate.Read the full Intel® Xeon® Processor C5500/C3500 Series Thermal/ Mechanical Design Guide.
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