Intel® Xeon® Processor C5500/C3500 Series: Thermal Guide
This document provides guidelines for the design of thermal and mechanical solutions for processors in the Picket Post platform. The components described in this document include:
•The processor thermal solution (heatsink) and associated retention hardware.
•The LGA1366 socket and the Independent Loading Mechanism (ILM) and back plate.
Read the full Intel® Xeon® Processor C5500/C3500 Series Thermal/ Mechanical Design Guide.
Presents research on multi-core processor performance optimization under thermal constraints.
Overviews the Intel® Atom™ processor E6xx series’ features and compatibility.
First Intel® Atom™ processor-based system-on-chip offers embedded system integration and flexibility.
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Demos applications including license plate, missing people, and threat recognition. (v.001, Oct. 2010)