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IXP45X/IXP46X Product Line: Thermal Design App NoteThis document describes the thermal characteristics for the IXP45X and IXP46X product lines. This document is used to properly design a thermal solution for systems implementing the following IXP45X/IXP46X product line parts:• Intel XScale® processor frequency 667 MHz.• Intel XScale® processor frequency 533 MHz.Properly designed solutions must provide adequate cooling to maintain the IXP45X/IXP46X product line case temperature (TCASE) at or below the values listed in Table 1. Ideally, this is accomplished by providing a low local ambient temperature and creating a minimal thermal resistance to that local ambient temperature.Read the full IXP45X/IXP46 Product Line Thermal Design Application Note.
Demonstrates how to use open source hypervisor, Xen* 3.0, and CentOS* 5.5. (v.1, Oct. 2010)
Measure actual power consumption of components and embedded systems. (v.001, July 2011)
Automatically change the boot up disk order to reboot in the event of failure. (v.001, Dec. 2010)
Recover and diagnose failure remotely, preventing costly downtime. (v.001, Dec. 2010)
Discusses increasing throughput for multi-core processors. (v.1, June 2009)
Demonstrates how to use a USB drive to boot a customer reference board to DOS. (v.1, June 2010)