Demonstration of concept to bring the endcap to life using Intel embedded technology.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.
Guide to LGA1567 socket independent loading mechanism installation for minimized contact damage.
Mandarin: LGA2011 socket independent loading mechanism installation guide, minimizing contact damage.
Step-by-step instructions for aligning Intel® motherboards and the I/O opening on a computer chassis.